E-Glass Fiber Fabric (Style 7628 / 2116 / 1080) for PCB & CCL — High Dimensional Stability & Electrical Insulation

Description

Product Overview & Description

Brief Summary

Our premium Electronic Grade (E-Glass) Fiberglass Fabric is engineered specifically as a structural reinforcement base for Copper Clad Laminates (CCL) and Printed Circuit Boards (PCB). Woven using advanced air-jet looms, it offers exceptional dimensional stability, high mechanical strength, and superior electrical insulation properties.

Detailed Product Description

Are you looking for a high-reliability reinforcement material to meet the rigorous demands of high-density, multi-layer PCB manufacturing? Our Electronic Grade Fiberglass Fabric provides the structural integrity and thermal endurance your production line requires.

Manufactured from high-purity E-glass formulations, raw materials are drawn into micro-filaments (4–9 µm) and woven with micro-tension precision. Our fabrics strictly adhere to IPC-4412 standards, delivering key technical advantages:

• Superior Dimensional Stability: Precise warp and weft tension control ensures a flat, uniform weave. The fabric maintains minimal deformation under high-temperature lamination, pressing, and etching processes.

• Excellent Electrical Insulation: Serves as the primary dielectric backbone for CCL. Its optimized Dielectric Constant (Dk) and Dissipation Factor (Df) help reduce signal attenuation and loss in high-speed, high-frequency circuit designs.

• High Mechanical Strength & Heat Resistance: Provides robust structural reinforcement, preventing PCB warping and bowing. Excellent thermal resistance makes it fully compatible with lead-free soldering operations.

• Optimum Resin Wet-Out: Treated with specialized silane coupling agents to ensure rapid, uniform epoxy resin impregnation, effectively eliminating internal delamination and white spots (measling).

• High Cleanliness Standards: Produced in cleanroom-monitored environments to guarantee zero oil contamination, loose threads, or conductive impurities.

Applications

• Printed Circuit Board (PCB) Fabrication (Rigid, Multi-layer, and High-Density Interconnect / HDI boards)

• Copper Clad Laminates (CCL) Manufacturing

• Insulation layers for Automotive Electronics, Telecom Gear, Server Motherboards, and Consumer Electronics

Technical Specifications

Note: The values below represent the standard 7628 style. You can adjust these figures if listing 2116, 1080, or custom specifications.